iPhone 4S can be unlocked without the hardware and software intervention

This unlocking allegedly allows AT & T version of the iPhone 4S in the networks of T-Mobile, and for its implementation will require a properly trimmed in size SIM card of the operator as well as a number of simple steps, including: insert the original SIM card AT & T

• Dial number 611 support subscriber AT & T and reset the call
• Insert mode on the plane
• Remove the SIM card from AT & T and insert it into an analogue of T-Mobile
• Make sure that the Wi-Fi is disabled (in network settings, you can click on the item "Forget this network" so that your smartphone is not connected to it automatically)
• Disable operation in the plane, then iPhone will look for the network.
• You will see a notification "is required to activate"
• Then automatically activates EDGE - in the upper left corner of the screen the letter E
• Wait about 20-30 seconds and turn off the smartphone
• Turn the iPhone, then re-appear on the screen warning "Requires activation"
• After the appearance of one bar of signal level, click on the item 'Use the connection to the network "
• Take out the SIM card, and then again get the message "Requires activation"
• Finally, insert the SIM card from T-Mobile's back and use at your pleasure unlocked device. 

We add that this method is also applicable to iPhone 3GS and iPhone 4 , but after a reboot the mobile device you will need to again go through this procedure. Apparently, the trick should work not only at T-Mobile, but it has not yet been confirmed by practical trials. Finally, we note that in this paper, we do not consider the ethical and legal aspects of the procedure unlock, and all experiments in this regard should solely at your own risk of and conscience.

Liquid metal can power future processor for Smartphones

Long as the industry has been operating at a high heat dissipation of circuits, and to stack multiple chips on each other is becoming more or less standard for certain types of circuits. IBM shows off a new interesting technique that involves both cooling and operating these types of circuits with liquid metal.

So-called 3D die-stacking, TSV (Through Silicon Via) is that you stack multiple chips on each other. This is common in today's smartphones, which have a system processor and etches the RAM on top. The advantages of this technique is faster transfer speeds, communication between the stacked chips and lower power consumption. The disadvantage is that the cooling circuits, but also to provide the upper circles of power.

IBM has developed a technology to solve both problems, while it is still in experimental stage, it sounds very interesting. IBM does a lot of artificial intelligence has taken inspiration from the human brain, using the same medium to transport heat and provide the brain (and other body) with energy.

"The human brain is 10.000 times more dense and efficient Than any computer today. That's Because it Possible Uses only one, extremely efficient, network of capillaries and Blood Vessels to transport heat and energy, all at the Same Time," IBM

It has made channels in their wafers to allow the liquid metal - in this case the element Vanadium - to flow through a circuit. When you then stack multiple chips on each other, there are channels to flow through it. In IBM's tests should I have stacked a hundred silicon-based circuits on top of each other.

Vanadium can lead to charge through the stacked chips to run them, and when it loses its charge, it can absorb heat, allowing it to act as cooling. The idea is that you have a single medium for both running and cooling the stacked chips.

3D die-stacking is the future, but the technology will be used to overcome the problems of power and heat generation?

If and when the technology is materialized in real products is not clear, and IBM has previously shown a similar technique with thermally conductive adhesive for the same use. But the potential of this technology from IBM is large, and can result in both higher frequencies and lower power consumption. Another problem can not think of when you only see all the numbers in GHz (gigahertz), is that as the transistors may work faster need faster communication between all types of circuits. Although this is 3D die-stacking is actually a solution to the problem when you place the chips on each other, creating minor delays between them.

What we can say is that TSV is the future of the semiconductor industry, and some type of technology will be required in future to overcome both power and heat generation. Could you imagine having liquid metal in the heart of your computer or smartphone?