Intel Speeds Ahead Third-Generation Graphics Cards for Works Better Technology

Intel Speeds Ahead Third-Generation Graphics Cards for Works Better Technology

Get ready for more innovation in the graphics card arena! Intel has revealed they're already developing their third generation of graphics cards, codenamed Panther Lake. This news comes shortly after the successful launch of Lunar Lake, their current generation boasting a 1.5x graphics performance improvement. Here's a breakdown of what we know so far:

• Generational Leap: Panther Lake signifies a significant step forward for Intel in the graphics card market. Scheduled for a 2025 launch alongside their new mobile chipset, details about the architecture and capabilities remain under wraps. However, based on the success of Lunar Lake, we can expect further advancements in performance and efficiency.
• Impact on the Market: With Intel's continued focus on graphics cards, the pressure is on for established players AMD and Nvidia. This increased competition is a positive sign for consumers, potentially leading to:
• More competitive pricing for graphics cards.
• A wider range of cutting-edge features across all brands.
• Benefits for Users: A stronger presence from Intel translates to a broader selection of graphics cards for both gamers and creative professionals. This expanded variety can cater to:
• Diverse needs: Gamers seeking high frame rates and creators requiring powerful rendering capabilities will have a wider pool of options to choose from.
• Varied budgets: With potentially more competitive pricing, users on different budgets may find a graphics card that meets their needs without breaking the bank.
• A Balanced Ecosystem: The increased competition can create a more balanced graphics card market. With all three major players (Intel, AMD, and Nvidia) pushing boundaries, the pressure to innovate is high. This constant drive for better technology can benefit the industry as a whole, accelerating the development of groundbreaking graphics solutions.

Conclusion

The arrival of Panther Lake is an exciting development for the graphics card industry. While specific details remain under wraps, it's clear Intel is committed to making waves in the market. With all three major players actively developing new technologies, the future of graphics cards looks bright for both manufacturers and consumers alike. We can expect to see a wider variety of options, potentially more competitive pricing, and continuous advancements in performance and efficiency in the years to come.

Intel will release a competitor to Apple TV with a camera to track viewers

Intel announced plans to launch its own online TV. Head of the company Eric Haggers said that before the end of the year Intel will release the appropriate set-top box with "nice industrial design" and well-designed software.

Intel plans to equip the camera set-top box, which will follow the user to provide them with personalized recommendations for viewing. This will allow the device to adjust to a specific audience. For example, the prefix will offer one set of programs for children, adults - on the other. In addition, by tracking the interests and habits of users, it will be able to provide targeted advertising.

The new service will provide live coverage of Intel, TV "after ether", at the request of the program and the necessary range of applications, said Eric Haggers. Service will also be available on mobile devices Apple. However, the company does not intend to provide proper services to users of Internet access service, as before, will have to connect to the web via a third-party provider.

Top-manager of Intel said that the new service will be used codec HEVC, provides higher compared to H.264 video quality to be used in most systems, cable and IP-TV. In Intel did not give an exact date for the launch of television and Internet service release set-top boxes.

Intel plans a price cut on SSDs in August

The Colossus of Santa Clara intends to operate a significant price cut of its SSD series 320, 330 and 520. This price drop expected in the month of August, is expected to reach as many as 37% even if the models do not affect low-capacity series 320.

 

The SSD 320 series it will undergo a price cut on the 300 and 600 GB models, the first rise from 519 to 464 dollars, while the 600 GB model from 1059 to $ 879 (retail price).

 

Following are the affected models to this price cut:

520 series

520 SSD 60 GB: OEM price down from $ 99 to $ 89; Reseller pack down from $ 109 to $ 99 (9% cut)

520 120 GB SSD: OEM price down from $ 179 to $ 129; Reseller pack down from $ 189 to $ 139 (26.4% cut)

520 180 GB SSD: OEM price down from $ 269 to $ 189; Reseller pack down from $ 279 to $ 199 (28.6% cut)

520 240 GB SSD: OEM price down from $ 339 to $ 249; Reseller pack down from $ 349 to $ 259 (25.8% cut)

520 480 GB SSD: OEM price down from $ 799 to $ 494; Reseller pack down from $ 809 to $ 594 (37.7% cut)

330 Series

330 60 GB SSD: Reseller pack price down from $ 94 to $ 69 (26.5% cut)

330 120 GB SSD: Reseller pack price down from $ 149 to $ 104 (30.2% cut)

330 180 GB SSD: Reseller pack price down from $ 234 to $ 154 (34.1% cut)  by

Announcement of the co-processors Intel Xeon Phi

During the event, International Supercomputing Conference, Intel announced a brand Intel Xeon Phi, which will be used to refer to all future products on the architecture of Intel Many Integrated Core Architecture (Intel MIC). Deliveries of the first such product shall commence before the end of this year. The first will be a family of co-processors under the symbol Knights Corner. As conceived by Intel, it will complement the family of CPUs, and Intel Xeon E5-2600/4600 will improve performance on tasks with a high degree of parallelism. The first generation of Intel Xeon Phi products will be focused on the use of supercomputers, but in the future, the manufacturer also expects to reach segments of the corporate VC and workstations.

 

The advantages of the Knights Corner Company considers the use of a familiar programming model for developers and compatibility with the tools to develop software for the architecture of Intel.

Co-processors Intel Xeon Phi will not only compatible with the software architecture models, x86, but can also be seen as separate applications to compute nodes, running its own OS based on Linux, regardless of the primary operating system and optimized for parallel computing. According to the manufacturer, it offers a high degree of flexibility in creating clusters, unattainable in the case of decisions based on the GPU.

 

Coprocessor is an expansion card for the bus PCI Express. It is a 22-nanometer chip, "with more than 50 kernels" , in the possession of which is "not less than 8 GB of memory GDDR5». Last year, Intel demonstrated a working one coprocessor Knights Corner , whose performance on the double-precision operations over 1 TFLOPS.

Although the serial products appear only at the end of the year, according to Intel, the first cluster based on Intel Xeon Phi 150 runs and took a position in the list of high-performance computers in the world Top500.

Intel Nuc: Mini-PC processor with 4-inch Ivy Bridge

From the site techreport leaked images of a new ultra-compact system designed by Intel , we talk about the mini-PC NUC , a small 4-inch case that integrates an Intel Core Third Generation, HM65 chipset and 4GB of memory in dual-channel DDR3 RAM. The processor is a Core i5 Ivy Bridge with Turbo Boost up to 2.70 GHz, a solution that perfectly matches all 'SSD 40 GB included.

 

Opening the small chassis you can see the motherboard connections mSATA, HMDI, mini DisplayPort, and Bluetooth and WiFi connectivity. Strangely, or definitely due to space constraints, however, does not support the Intel Nuc but only 2 USB 3.0 ports USB 2.0.

 

The mini-PC Intel NUC should come to market, according to the site, in the third quarter of 2012 at a price of 400 dollars.  By

Wireless charging for your Android with Intel Ultrabook

Ah, the wireless charging . There is a long time and is based on a principle sufficiently simple, but is not yet so widespread in the consumer. One of the first devices with wireless charging was the Palm Pre , now defunct but still an example for more than one aspect. The "problem" of the Pre, as the current smartphone, you need to remember the cord and charger - even if inductive . With future Ultrabook this need may be to fall, as Intel has shown a prototype at Computex that can load an inductively Android smartphone positioned on one side . That's right: no need for cables, or special arrangements phone.

 

It is sufficient to apply a small device to a smartphone and put it to the right Ultrabook , in contact with the body. You do not need to do or remember to bring cables, adapters, power supplies and anything else. A godsend for someone like me, you just carry around laptops, tablets, smartphones, MP3 players and more.

Intel is pushing you to the inductive load is integrated within future devices in order to prevent add-on weighing and encumber. Certainly, however, are willing to sacrifice some 'weight and footprint for not having the hassle of having to remember cables, wires. Surely it is not a bad idea that will hopefully be implemented in the future on all notebooks. We'll have to wait a few more years, but it might be worth really worth.

Intel Ivy Bridge 3770K overclocked to 7.03 GHz on Gigabyte Z77X-UD3H (Video)

This was another record for Gigabyte announces that it has reached the highest frequency in overclocking an Intel Ivy Bridge 3770K. During the session was used to overclock a motherboard GIGABYTE Z77X-UD3H , a motherboard that under the hands of the famous overclocker HiCookie clocked a CPU frequency of 7.03 GHz .

The cooling was obviously used as liquid nitrogen, the voltage supplied to the CPU well 1.956 volts. The following screen shows only the validation of HWBot.org and then for the moment no benchmark was performed at these frequencies.

HiCookie clocked also the maximum frequency for DDR3 platform Ivy Bridge reaching 3280MHz with all 4 memory slots occupied, in which case we used a GA-Z77X-UD5H and memories G.Skill Trident X.

Here's a video that portrays the overclocking session:

Intel will develop 14-nanometer process technology in the factories in the U.S. and Ireland

Intel manufacturing complex for production of semiconductor products, located in Ireland, including two named in the company's other businesses, where the planned development of technological standards, "14 nm or less." It is alleged that the related investment will exceed 1.25 billion dollars.

 

As can be seen on a slide from a presentation Intel, 14-nanometer process technology to be implemented in a factory in Oregon, D1X, Fab 42 in Arizona and Fab 24 in Ireland.

It is expected that the use of 14-nanometer process technology will begin in 2013.

"We are in process of construction and initial installation of equipment for 14 nm and then in Oregon, Arizona and Ireland" - quoted a source word CEO.

In 2009, Intel closed its Fab 14 near Dublin, reducing the number of factories in the complex to three: Fab 10, 24 and 24-2. In January last year it became known that the modernization of the oldest of them, Fab 14, is planned to allocate approximately $ 500 million.

The Intel Core i5-3350P will be the 'Hyper Threading

It seems that Intel has plans to release soon a new Processor Core i5-3350P , a CPU-based architecture Ivy Bridge and then built with 22 nanometer manufacturing process. Like his models i5 and Core i5-2380P-2450P, even for the Core i5-3350P is not provided integrated graphics.

The 'i5-3350P is a Quad-Core and will have a core clock of 3.1 GHz (3.3 GHz in Turbo mode), we find onboard 6 MB of L3 cache and Hyper Threading technology support, usually not integrated by the manufacturer on Core i5 models.

According to the source of the Intel Core i-3350P will have a TDP of 69 watts and should reach the market in summer, a solution that, given the specific requirements, may make the throat to many users. Currently we have no information regarding the possible sale price.

Intel has decided to phase out the processor Atom D2700

Intel has published a notice of changes (Product Change Notification, PCN) at No. 111445-00, which states that the range of Atom processor family will leave the flagship model D2700. Moreover, it should be noted, would leave very quickly: the CPU orders will be accepted until June 29, and the last shipment will be held no later than September 28th of this year.

 

Intel Atom D2700, we recall, was introduced in late September last year. CPU is the flagship line of Cedarview-D: it has two cores, supports multi-threading Hyper-Threading and runs at 2.13 GHz. Manufacturer's suggested price of the product to date is $ 52.

Intel processors in overclocking and problems Ivy Bridge

Intel admits the problems of processors Ivy Bridge, caused by the new technology of heat dissipation. The company is know, however, not to be concerned since it is of a different way to produce the processor and therefore can be solved. This could then lead to a new series of processors Ivy Bridge, but there are still news confirmed by the company.

 

In processors Intel Ivy Bridge fact, under the IHS there is a thermal paste instead of a normal welding fluxless used on other processors. This system therefore would not be sufficient to dissipate the heat produced during overclocking sessions, causing instability.

We'll see how the situation will evolve and we'll let you know if we will have updates in this regard.

Intel has acknowledged that Ivy Bridge CPU overclocking hotter than Sandy Bridge

According to sources, Intel acknowledged that the Core of the third generation (Ivy Bridge) to disperse run hotter than their predecessors. Messages that hot new processors began to appear shortly after the premiere April 23 Ivy Bridge .

Ivy Bridge processors have become the world's first 22-nanometer processors. That transition to finer process technology is partly due to increased heat to disperse. The fact that the die is smaller and therefore decreased and the area of ​​its contact with the plate playing the role of the lid of the processor. In other words, increased "heat flux". Another cause of overheating - the refusal of the solder paste in favor of the role of the thermal interface, originally discovered by enthusiasts, and now confirmed by the manufacturer.

 

Specify that a higher temperature is observed only when working at higher frequencies, so to speak ill of the defect. Confirms this, and the manufacturer, saying that the processors' correspond to the expectations of quality and reliability when operating under normal conditions. " Sources: TheInquirer , Overclockers

Intel Core i7 3770K Ivy Bridge, the first time to 22 nanometers

After much anticipation and a little snooze, today is finally the day of processors Intel Ivy Bridge , the first ever to be built with 22 nanometer manufacturing process. In the era of communication digital and social networks, has become almost impossible to hide the news, which is why in recent months the information (including details) on the new Intel platform are circulated without problems.

We start by summarizing what are the characteristics Main (already partly known) CPU Intel Core Third Generation.

In the now well-known method of development of the house of Santa Clara, Ivy Bridge belongs to the phase Tick, effectively introducing a new production process, while keeping the same architecture and the same socket with the previous generation of CPUs. In this case, therefore, Ivy Bridge uses a socket LGA 1155, backward compatible with motherboards designed for Sandy Bridge Series 6.

More important news, which we'll do better to follow, are then the new Tri-gate transistor, the graphics component Intel Graphics HD 4000 and the introduction of 7-series chipset.
Before proceeding further it should be noted that, as happened to Sandy Bridge, Intel released on time what we can define (by price) the solution of the mainstream, then remain on site solutions for the band arriving on Extreme LGA 2011 (see Ivy Bridge-E).

Today, April 23, Intel launched a supply of new generation processors, code-named Ivy Bridge. This was reported by a number of foreign online resources, Information on the official website of the company is missing.

From today, Intel will begin deliveries of 13 models of 4-core processors with four cores in a series of Core i5 and Core i7, the bulk of which is designed for desktops and laptops. To supply a new generation of processors with lower ultrabook Intel plans to begin later, but before the end of spring. Many analysts expect seriously that Apple will not resist the temptation to use the chips in the first wave of an updated line of MacBook Pro.

Ivy Bridge processors have several important innovations. First, these are the first chips, which are made on the basis of 22-nm process. Secondly, this is the first processor, which incorporates "three dimensional" transistor made by technology Intel 3D Tri-Gate.

Unlike conventional transistors, 3D Tri-Gate valve is a three-dimensional structure, increasing the area through which the electrons move. This reduces the drive current and, consequently, the leakage current. At Intel, the transition to such semiconductors are called revolutionary because, according to company representatives, to no one involved in mass production of transistors.

It is noted that the processors Ivy Bridge is 20% faster than previous generation chips while consuming 20% ​​less energy. By analogy with Sandy Bridge processors in the new graphics cores are placed directly on the same chip as the main computational kernel. It is reported that "the people who use integrated graphics solutions, along with the new chips will be one of the most tangible benefits." In addition to working with Full HD-video, these include a more rapid conversion of videos.

Note that in 2013 replaced the Ivy Bridge processors come Haswell , in which the corporation plans to 20 times better performance of energy consumption in standby mode. The company expects that this improvement will be equivalent to 10 days of the laptop in standby mode, if you have a permanent network connection.

The world's first smartphone based on the Intel announce April 23

Intel and Lava , one of the fastest growing Indian companies for the production of smartphones, announced this week that the new smartphone Lava Xolo X900 , which will be the first smartphone based on the Intel processor will be launched in India on April 23.

 

Lava Xolo X900 is based on the Atom processor with a frequency of 1.6 GHz and technology Hyper Threading, as well as the graphics chip with a frequency of 400 MHz and support for recording and reproducing video format Full HD 1080p.

New offers 4.3-inch LCD high-resolution 8-megapixel camera with fast shooting up to 10 frames per second, as well as battery operation time in 3G mode up to 5 hours, 45 hours of music playback and 8 hours of talk time. Information on price, as well as the availability of the device in other markets yet.  Source: Wired.com

Qualcomm and Nvidia at loggerheads with TMSC, next to 28Nm chips entrusted to Samsung?

Two of the largest U.S. chipmaker, Qualcomm and Nvidia , are beginning to reckon with a poor yield of the production 28Nm carried out by TMSC , Taiwanese semiconductor company to which they refer many organizations in the field. Already last month came forward signals determined by Nvidia CEO Jen-Hsun Huang, who said in Forbes hope that establishments Intel could "accommodate" the production of the next (SoC Tegra 4) and Kepler GPU to 28Nm. Vain hope given the response of the lapidary home in Santa Clara:

Thanks, but no thanks

TMSC has therefore serious problems in the manufacturing shift to a more sophisticated architecture and is the right partner with which to face future challenges in the mobile industry. For this reason the search started for an alternative that may provide greater safety and the names circulating are the United Microelectronics, Global Foundries and even Samsung , which relies on the structures of Austin, Texas, in the further modernization and expansion.

Be noted that Nvidia stands to lose more with Tegra SoC and 4 GPUs Kepler just waiting to start production for a market introduction in early next year as announced on the roadmap . A delay would be really catastrophic and would leave the field open to emerging reality with better means as Intel , colossus that may rely on its facilities and is already producing in large volumes to 22Nm. No small advantage.

TMSC, meanwhile, is investing huge sums to adapt to the situation and, if it has to deal with the discontent of Nvidia and Qualcomm, can also enjoy the positive approach of recent Apple and AMD obviously aim at different targets. The chipset market will be even more busy in the months and Intel, which is emerging only now seriously in the mobile sector, could be a real thorn in the side.

Intel and Microsoft expect to mid-2013 to reduce the share of the market iPad tablet up to 50%

According to a source that refers to the words of the Taiwanese electronics manufacturers, working under the ODM, Intel and Microsoft are working closely with suppliers plates of the first echelon in the development of tablet with Windows 8. The aim of partners - to press Apple on the world market. Now the devices Apple iPad owns 70% of the market, but by 2013 Intel and Microsoft expect to reduce the proportion of iPad up to 50%.

In September, Microsoft will release Windows 8 for x86-compatible platforms, and later - Windows RT for ARM. It is expected that the appearance of these operating systems, more precisely, the plates under their control, to change the balance of power in the market of tablets.

According to current estimates, up to the end of the year, the company Hewlett-Packard, Dell, Lenovo, Acer, ASUSTeK Computer, and Toshiba will release 32 models tablets with Windows 8. In particular, Lenovo and Acer are planning to release several models, covering the price range from $ 300 to $ 1,000. Entry-level models will be sold even cheaper than $ 300, which will enable them to compete with the tablet running Android, which produce unnamed Chinese manufacturers. More expensive models will compete with Apple iPad.

Samsung Electronics is trying to convince Intel to accelerate the introduction of DDR4 memory

According to the source, referring to information from industry observers, Samsung Electronics is trying to convince Intel to release a server platform with support for DDR4 memory ahead of schedule. As you know, Intel plans to implement DDR4 is scheduled for 2014 .

Samsung's interest due to the fact that the release of DDR3 memory chips become unprofitable because of low prices.

While the transition to DDR4 ready only Samsung and Hynix Semiconductor. If DDR4 memory was in demand in the near future, it would provide these companies a significant competitive advantage. Recall, the company released the first Samsung DDR4 memory modules in January 2011, and in April the same year, his success in the development of DDR4 memory Hynix said .

Given how even the bankruptcy of Memory has not changed the situation on the market, DRAM, the transition to DDR4 industry experts is the only way out of the crisis of overproduction. Observers believe that the transition to DDR4 will happen faster than the transition from DDR2 to DDR3, which took three years.

The organization JEDEC Solid State Technology Association should adopt a standard DDR4 in the middle of this year.

Intel calls to increase the resolution of screens: 13-inch ultrabook could have a resolution of 2800 x 1800 pixels

The event IDF 2012, Intel shared not only his vision of how to become thin drives for ultrabook, but also considerations for resolution computer screens.

The starting point for determining the screen resolution, for obvious reasons, were taken possibility of human vision. When permits are accepted like 1366 x 768 and 1920 x 1080 pixels one discerns the individual pixels, staring at the screen desktop monitor or laptop from the normal range, because the pixel density is about 100 pixels per inch. The image becomes a "smooth" so that a further increase in the density of pixels does not affect the perception of where the pixel density is about 220 pixels per inch in a desktop PC, 250 dots per inch - mobile PCs and 300 dots per inch - in smartphones and tablets. By the way, even the Apple iPad tablet screen barely up to this assessment: given the amount of 9.7 inches with resolution of 2048 x 1536, it is characterized by a density of 264 dots per inch.

This means that for smartphones with five-inch screens, located at a distance of 30-40 cm from the eye, it is optimal resolution of 1280 x 800 pixels. Tablet with a screen size of 10 inches, usually dealt with the same distance, must have a resolution of 2560 x 1440 pixels.

Ultrabook with screens measuring 11 and 13 inches, according to Intel, should have a resolution of 2560 x 1440 2800 x 1800 pixels. For notebooks with screens measuring 15 inches specified resolution 3840 x 2160 pixels. The same resolution, according to Intel, should get a one-piece PC screens and 21 inch sizes.

The Intel expects that the transition to displays with high pixel density will begin next year.  

Source: Liliputing.com

Ivy Bridge-EP/EX Preview: 15 core?

Ivy Bridge will soon be released. Although there 22nm process, native USB 3.0/PCI-E 3.0, many new bright spot, but stagnant for the pursuit of high-standard hardware players, four core, 8MB L3 cache seems I could not get the nature of . Well, look at the server field of the dual Ivy Bridge-EP, four Ivy Bridge-EX is how? The fastest within a year you can see them.

 

Ivy Bridge-EP is obviously the successor of Sandy Bridge-EP, still uses the LGA2011 package interface , named will continue to be included in the Xeon the E5 sequence, have up to 10 core, 25MB L3 cache (say 30MB, but it seems do not fly), the frequency will increase by 15-20% .

22nm import of new technology is expected to resolve troubled Sandy Bridge-EP, the high power consumption, high heat, not only a higher frequency of high-performance version will have lower power consumption, energy-saving version is expected to 95W, 130W, 150W can see the three grades of thermal design power, respectively, 2.4GHz, 3.0GHz, 3.3GHz around ten-core models.

The same time, the desktop the fever platform of Ivy, Bridge-E can also expect the eight-core and even 10-core model , not content with "mere" six core Core i7-3960X players blessed.

Ivy, Bridge-EP, with the chipset will Patsburg C600, but the stepper should be updated, SAS the 6Gbps the class will cease to exist, but to look at the Intel can perfect solution to the storage controller.

Ivy Bridge-EX look for four large-scale server and data center, which is a new generation of the Xeon the E7 - and so on, one or Westmere-EX, then the middle of the Sandy Bridge-EX Where to go? Sorry, it does not exist. Before the arrival of the 22nm process, the more cores, cache, features stuffed together is too difficult, Intel simply skip this step, but with the time of the Ivy, Bridge-EP, will be closer.

Ivy Bridge-EX core of a very strange number, instead of the traditional multiple of 2, but 15. Intel Why do so in the end is how to do, or even intelligence, or perhaps the final 16-core yet clear.

Each core corresponding to the L3 cache or 2.5MB , but the frequency will be lower than the Ivy Bridge-EP a lot, estimated that no more than 2.4GHz (currently top of the Xeon the E7-4870 this speed). Memory controller will be integrated into four, with expandable memory buffer chip supports eight-channel DDR3-1600 memory, the maximum capacity of 1.5TB (four is 6TB).

QPI bus is 23 , two more than the Ivy Bridge-EP Westmere-EX, but less than four. Three QPI bus for the four-way system, just not too much, but if you want the outside to join the MIC all the core architecture to calculate the expansion of the cards and the like, and then to make a detour, and will naturally increase delay. Taking into account the future Haswell-EX the Braodwell-EX will follow the same platform as the QPI bus limit some really justified.

Intel 22nm to find a third OEM customers

Silently between Intel's OEM business is growing up. Archronix, Tabula, a leading manufacturer of flow processor (flow processors all the) Netronome today became the Intel 22nm process customers. Netronome said that based on the strategic partnership with the Intel Custom Foundry, the two sides will jointly offer the world's first 3-D of the Tri-Gate transistor technology flow processor , have revolutionized the performance of network and security applications, mid-stream processor , power and cost targets, in particular, the performance will reach the highest of similar products.

Of Netronome, Intel also OEM launched a very in-depth cooperation, involving wafer optimization, equipment, packaging, assembly and testing, worked together to accomplish the high quality of design for manufacturing (DFM), the test design (DFT), reliability design (DFR).

The Netronome stream processors manufactured by Intel 22nm process is expected to pilot production in 2013 , mass production and shipping dates to be determined.

The Netronome a fabless semiconductor company, the main product solutions include stream processing silicon, software, tools, and acceleration platform, speed 200Gbps-ranging, its customers are telecom operators and large communications companies around the world.