TSMC allowed to build a factory, designed for 450-mm plates

According to Reuters, the company TSMC, the world's premier contract manufacturer of semiconductor products, has confirmed the intention to build a factory designed for wafer diameter of 450 mm. On Monday it was announced that Taiwan's government has approved a request TSMC to build the company in the central part of the island. The total amount of the investment is estimated at 8-10 billion dollars.

 

The maximum diameter of the wafers used in the industry today, is 300 mm. Factories of the next generation will be calculated on a plate diameter of 450 mm. Transfer to a plate of larger diameter will reduce the cost of production, but he involves substantial costs and require solving many technical problems.

According to TSMC, the transition to the use of 450-millimeter wafers will take about five years. Other companies are also planning to launch production using 450-millimeter wafers. In particular, TSMC believe that such plans have a Samsung. As for Intel, the manufacturer intends to allocate up to $ 8 billion to expand business in Arizona and Oregon in the construction of a new factory that can process 450-millimeter wafer. Source: Reuters